MPi Fine Pictch Probe Cards






Canteliver Probe Card

MPI Cantilever Probe Card is broadly applied on gold bump and pad wafer screening for Display screen driver, logic, and memory unit. MPI’s cantilever probes would be the corresponding response to the demands of fi­ne pitch, tiny pad sizing, high speed, fewer cleansing, multi-DUT, high pin count, and ultra-minimal leakage demands. With superb craftsmanship, modern architecture and established methodologies based upon mechanical and electrical simulation/measurement success, making MPI the top cantilever service provider globally.


FCB Probe Card

The FCB Probe Card is among the most mature engineering of buckling beam probe card. It can be aimed to accomplish the semiconductor ship manufacture time-to-current market (TTM) and value of examination (COT) desire. FCB is actually a verified Answer for many different semiconductor production checks from early engineering pilot-operates to substantial volume manufacturing (HVM). FCB is prepared for system necessitating higher sign integrity probing (SI) and/or electric power integrity probing (PI). Programs consist of chopping-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, plus more. FCB guarantees the whole world’s finest All round Price-of-possession (COO) for different DUT applications.


EVS Probe Card

The EVS Probe Card is really an enhancement around the traditional buckling beam probe card. Key options are increased present carrying ability (C.C.C.) and reduce well balanced Get in touch with pressure (BCF), along with In general MEMS-like attributes. EVS can certainly satisfy the need of Superior wafer probing. Specific alignment and outstanding planarity Command will be the vital aspects contributing to secure contact resistance. With its ability and general performance, EVS Probe Card is a great option for advanced probe cards.


Osprey probe card

The Osprey probe card is MPI’s Resolution to demand from customers for ever finer pitch. It truly is suitable for smaller Al pad, and is also perfect for little pitch software with peripheral and full array pattern. With exact alignment and superior planarity Command, Osprey can attain larger efficiency by multi-DUT structure.  The forming wire (FW) kind needle made with MPI’s possess micro fabrication course of action not only provides high-high quality efficiency but in addition lets uncomplicated needle substitution and shortens protecting cycle time.



Kestrel Probe Card

The Kestrel Probe Card is provided with MEMS wire (MW) needle which happens to be suitable for the demand from customers of very low pressure probing. What's more, it includes the chance to satisfy higher C.C.C. and higher pin counts software. The MEMS system makes sure remarkably regular needle attributes, along with the Particular construction design permits exact alignment and planarity Handle.


MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, FCB Probe Card CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.

https://www.mpi-corporation.com/probecard/

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